BS EN 62137-2004 环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN
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【英文标准名称】:Environmentalandendurancetesting-Testmethodsforsurface-mountboardsofareaarraytypepackagesFBGA,BGA,FLGA,LGA,SONandQFN
【原文标准名称】:环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN
【标准号】:BSEN62137-2004
【标准状态】:现行
【国别】:英国
【发布日期】:2004-09-22
【实施或试行日期】:2004-09-22
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Bendtesting;Changesoftemperature;Continuitytests;Discretedevices;Durability;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Endurancetesting;Endurancetests;Environmentaltesting;Integratedcircuits;Life(durability);Materialstesting;Operatingtemperatures;Printed-circuitboards;Reliability;Semiconductordevices;SMD;Solderedjoints;Solderingpoints;Surfacemounting;Temperaturecycles;Temperatureresistant;Testonchangesoftemperature;Testing;Thermalcycling;Thermalshockendurance;Thermalshockresistance
【摘要】:ThisInternationalStandardspecifiesthetestmethodandguidelinesforevaluatingthequalityandreliabilityofboards,solderlands,solderprocessandsolderjointsofreflowsoldermountedareaarraytypepackagesandperipheralterminaltypepackages.Thisstandardtestsfordurabilityagainstmechanicalandthermalstressreceivedduringorafterthemountingprocessofdiscretesemiconductordevicesandofintegratedcircuits(hereinafterbothreferredtoassemiconductordevices)usedmainlyforindustrialandconsumeruseequipment.Thetestmethodspecifiedinthisstandardisanintegratedonebyincludingtheevaluationmethodofmountingmethods,mountingconditions,printedcircuitboards,solderingmaterials,andsoon.Itdoesnotspecifytheevaluationmethodoftheindividualsemiconductordevices.Mountingconditions,printedwiringboards,solderingmaterials,andsoonsignificantlyaffecttheresultofthetestspecifiedinthisstandard.Therefore,thetestspecifiedinthisstandardshallnotberegardedastheonetobeusedtoguaranteethemountingreliabilityofthesemiconductordevices.Thetestmethodisnotnecessaryifthereisnostress(mechanicalorothers)fromanyofthetestscoveredinthisstandard.
【中国标准分类号】:Z04
【国际标准分类号】:31_020
【页数】:30P;A4
【正文语种】:英语
【原文标准名称】:环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN
【标准号】:BSEN62137-2004
【标准状态】:现行
【国别】:英国
【发布日期】:2004-09-22
【实施或试行日期】:2004-09-22
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Bendtesting;Changesoftemperature;Continuitytests;Discretedevices;Durability;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Endurancetesting;Endurancetests;Environmentaltesting;Integratedcircuits;Life(durability);Materialstesting;Operatingtemperatures;Printed-circuitboards;Reliability;Semiconductordevices;SMD;Solderedjoints;Solderingpoints;Surfacemounting;Temperaturecycles;Temperatureresistant;Testonchangesoftemperature;Testing;Thermalcycling;Thermalshockendurance;Thermalshockresistance
【摘要】:ThisInternationalStandardspecifiesthetestmethodandguidelinesforevaluatingthequalityandreliabilityofboards,solderlands,solderprocessandsolderjointsofreflowsoldermountedareaarraytypepackagesandperipheralterminaltypepackages.Thisstandardtestsfordurabilityagainstmechanicalandthermalstressreceivedduringorafterthemountingprocessofdiscretesemiconductordevicesandofintegratedcircuits(hereinafterbothreferredtoassemiconductordevices)usedmainlyforindustrialandconsumeruseequipment.Thetestmethodspecifiedinthisstandardisanintegratedonebyincludingtheevaluationmethodofmountingmethods,mountingconditions,printedcircuitboards,solderingmaterials,andsoon.Itdoesnotspecifytheevaluationmethodoftheindividualsemiconductordevices.Mountingconditions,printedwiringboards,solderingmaterials,andsoonsignificantlyaffecttheresultofthetestspecifiedinthisstandard.Therefore,thetestspecifiedinthisstandardshallnotberegardedastheonetobeusedtoguaranteethemountingreliabilityofthesemiconductordevices.Thetestmethodisnotnecessaryifthereisnostress(mechanicalorothers)fromanyofthetestscoveredinthisstandard.
【中国标准分类号】:Z04
【国际标准分类号】:31_020
【页数】:30P;A4
【正文语种】:英语
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